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UV laser markers utilize ultra-violet light, typically at a wavelength of 355 nm, to mark or process materials. This wavelength, which is about one-third that of typical fiber lasers, enables UV lasers to perform tasks that other laser markers cannot. The shorter wavelength results in significantly higher absorption and a much smaller beam spot, allowing for high-contrast and damage-free marking on metals and plastics. This capability is ideal for marking smaller or more precise parts and is especially beneficial for heat-sensitive materials or components that require precision beyond the reach of standard fiber lasers.

Compared with infrared laser, UV laser has smaller spot light and it can reduce the workpiece mechanical deformation during processing. It’s mainly used for ultra-fine marking or engraving. It is suitable for food marking, medical or plastic packaging marking, micro hole marking, glass high-speed division and silicon wafer graphics cutting.

How Does a UV Laser Marking Machine Work?
The principle behind UV laser marking is similar to that of traditional laser marking machines, which use laser beams to create permanent marks on the surfaces of various materials. However, UV laser marking distinguishes itself by using short-wavelength UV laser beams to break the molecular bonds of the material directly, rather than evaporating the surface to expose deeper layers. This results in the precise etching of patterns and text without damaging the surrounding material.

UV laser marking is a form of cold engraving, a process known as the “photoetching” effect. This method involves using high-energy UV photons to break the chemical bonds within the material or its surrounding medium, causing non-thermal damage. Unlike traditional laser marking, UV laser marking does not generate heat, thus avoiding thermal deformation of the inner layer and adjacent areas of the material. The high-energy UV photons cause the molecules on the surface of metals or non-metals to detach without generating heat, making UV laser processing a true cold processing method. This fundamental difference sets it apart from traditional fiber laser marking systems.

Why Choose a UV Laser Marking Machine for Plastics, Silicon, Glass, and Ceramics?
The UV laser marking machine excels in delivering ultra-fine and precise markings on special materials due to its unique low-power laser beam. This makes it the preferred choice for customers with high standards for marking quality. It is particularly suited for the high-end market requiring ultra-fine processing, producing fine, clear, and permanent markings.

Key Benefits:
High Beam Quality and Small Focused Spot: Ensures finer and higher-definition markings.
Minimal Heat-Affected Zone: Prevents thermal effects, avoiding deformation or scorching of the processed material.
Wide Range of Applicable Materials: Effectively handles materials where fiber laser marking falls short in detail and effect.
Fast Marking Speed and High Efficiency: Capable of online flying marking on assembly lines, boosting production efficiency.
With its ability to perform detailed and precise markings without thermal damage, the UV laser marking machine is ideal for a variety of applications, including plastics, silicon, glass, and ceramics, making it an indispensable tool for industries that demand high-quality marking solutions.

Precision Marking for Heat-Sensitive Materials
Our UV laser marking machines use ultra-violet light at a 355 nm wavelength to provide unparalleled marking and processing capabilities. This shorter wavelength offers significantly higher absorption and a much smaller beam spot compared to typical fiber lasers. Here’s why our UV laser marking machine is the ideal solution for your marking needs:

High-Contrast, Damage-Free Marking: Achieve crisp, clear markings on both metals and plastics without causing any damage to the material.
Precision Marking: Perfect for small, intricate parts requiring the highest level of detail and accuracy.
Ideal for Heat-Sensitive Materials: Safely mark materials that are sensitive to heat, ensuring the integrity of the component is maintained.
Versatile Applications: Suitable for a wide range of industries including electronics, medical devices, automotive parts, and more.

Features and Benefits
Enhanced Absorption: The 355 nm wavelength ensures superior absorption, allowing for more efficient marking processes.
Minimal Heat Impact: The UV laser operates with minimal thermal effect, making it suitable for delicate materials.
Small Beam Spot: Allows for fine, detailed marking with exceptional precision.
High Efficiency: Optimized for both speed and accuracy, enhancing your production capabilities.

UV Laser Marking Applications
UV lasers feature a highly absorptive wavelength of 355 nm. This is dramatically shorter than general laser marking and processing systems which allows many materials to absorb it at a much higher rate. The shorter wavelength also allows a UV laser to perform “cold marking.” This is characterized by photolytic processing of the materials bonds to create contrast or remove material.
General lasers use a thermal process of vibrating the bonds of material, via heating, to the point that they break.
This often leads to a heat affected zone (HAZ), which is a zone surrounding the mark where material properties are changed due to heat exposure. This can damage products or create more scrap.
UV lasers remove the risk of this heat affected zone as marks stay more surface level, while still creating permanency. A UV laser is ideal for almost any plastic, resin, glass, rubber, or ceramic needs, as well as any metal marking or processing application where the effects of laser marking on the materials surface finish may be a concern.

Applications
• Flexible circuit board (FPC) marking, cutting
• Micro hole machining
• Wafer scribing
• Non removal of metal surface
• Fine marking, a variety of polymer materials, marking and micromachining